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STATS ChipPAC expands in Singapore

Nurdianah Md Nur | May 30, 2013
The company plans to invest S$620M over the next three years and increase its staff count in the city-state by 12% this year.

STATS ChipPAC Ltd, the provider of advanced semiconductor packaging and test services, opened a new building in Singapore on Tuesday (28 May 2013) as part of its expansion in the city-state.

The company has made Singapore into its global hub for advanced wafer level technology R&D and wafer level packaging centre of excellence for advanced mobile devices.

STATS ChipPAC has to date invested an estimated S$2.1 billion (US$1.7 billion) in Singapore to increase its technology offerings and manufacturing capacity. To meet the increasing demand for mobile devices, the company expects to pump in a further S$620 million (US$500 million) over the coming three years.

"Mobile technology convergence is pushing the boundaries for smaller form factor, higher performance, increased functionality and lower cost semiconductors. In 2012, more than 60 percent of the 2.5 billion chips we manufactured in Singapore went into mobile handsets, smartphones and tablets," says Tan Lay Koon, president and CEO of STATS ChipPAC.

At 808,000 sq ft (75,065 sq m), the STATS ChipPAC building is the largest Outsourced Semiconductor Assembly and Test (OSAT) operation in Singapore, according to the company.

STATS ChipPAC Singapore (SCS) has led the semiconductor industry in various breakthrough manufacturing and technology achievements over the last three years with a fan-out wafer level package known as embedded Wafer Level Ball Grid Array (eWLB). The recently expanded operation will support STATS ChipPAC's rapidly growing wafer level business for advanced mobile devices, and enable the company to focus on the further development of its Post Wafer fab Process (PWfP) business.

PWfP is an emerging business area between the front-end wafer foundries which create silicon wafers and the OSAT providers that handle back-end packaging and test. STATS ChipPAC claimed to have established a leadership position in the industry with a comprehensive platform of wafer level technology solutions that include Fan-in Wafer Level Packaging, Fan-out Wafer Level Packaging, Integrated Passive Devices and Through Silicon Via.

Given the development of PWfP and the expected rapid growth expected in wafer level technology, ChipPAC plans to increase its Singapore staff count by 12 percent in 2013 over its current 2,500 employees here.

 

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