UTAC Holdings Ltd, a Singapore-based semiconductor testing and assembly services provider, introduced today two new offerings to bolster its quad flat no-lead (QFN) portfolio.
These include a 0.3mm thin QFN package and a side lead plating (SLP) process that improves QFN solder joints for automotive, aerospace and other harsh environmental applications. Both offerings are qualified with major customers and scheduled to go into mass production in the second half of 2015, according to a media statement.
This latest addition of UTAC's thin QFN portfolio will allow customers to meet increasing market demand for slimmer, lighter products, such as smartphones, smart watches, fitness bands, and smart cards; while retaining the same QFN product features of low power, high performance and value.
According to the company, UTAC has been qualified by major automotive customers for its QFN side lead plated solutions - also termed a "wettable flank solution" - which improves QFN solder joints for improved printed circuit board assembly throughput and solder joint reliability. This solution is commonly used for a wide range of automotive devices, such as airbags, car distance sensors, and rear view mirror camera processors.
"We believe QFN packages will be one of the fastest growing package types in the industry fueled by proliferation of Internet of Things (IoT) devices with increasing usage of sensors, microcontrollers and communication chips in smart devices and automotive," said Asif Chowdhury, UTAC Senior Vice President of Product Line & Marketing. "With UTAC's broad QFN portfolio and ability to provide full-turnkey services, we are well positioned to support this growth and deliver market-relevant QFN solutions to meet the needs of our customers."
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