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AMD reportedly working on a monster exascale APU

Andy Patrizio | Aug. 6, 2015
Just a week ago, President Barack Obama signed an executive order for a coordinated federal strategy into HPC to build the world's first exascale supercomputer. The Department of Energy, the Department of Defense (DoD), and the National Science Foundation (NSF) will work on the project.

Other details on this megachip include 64 lanes of PCI Express Gen 3, 14 lanes of SATA III, 4-channel DDR4 with a total capacity of 256GB per channel and a new memory interconnect called Global Memory Interconnect that will act as an interface between the Zen die and Greenland die or between the two chips on the same multi-chip module package.

It's still all speculation of course. But for once, it's good speculation. The only question is how hard will AMD come back after pretty much ceding the server market. Well, there's that and one more question: can AMD hang on? The mystery chip is not due until 2016 or 2017 and the company has taken it on the chin lately. Here's to hoping AMD can hang in there.

Source: IT World

 

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