The stacked memory chips will be linked through a wire-like connection called Through Silicon Via (TSV), which is also used in emerging Hybrid Memory Cube technology, which stacks DDR3 memory. The TSV link improves throughput for memory transfers.
The unified memory technology in Pascal will make GPU and CPU memories into shared resources. That will increase the amount of memory available in a system. Nvidia already offers CUDA 6 parallel programming tools with memory management features to make GPU memory as readily accessible as CPU memory.
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