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Collaborating to develop low-cost interposer technology

Nurdianah Md Nur | May 29, 2013
The collaboration involves A*STAR IME, Qualcomm Technologies and STATS ChipPAC.

Singapore's A*STAR Institute of Microelectronics (IME) has announced that it will be working with Qualcomm Technologies Inc and STATS ChipPAC to develop technology building blocks for Low Cost Interposers (LCI) for 2.5D ICs.

Prof. Dim-Lee Kwong, executive director of IME, said the 2.5D IC technology would provide opportunities to increase the functionality and performance of semiconductor ICs. He added that a collaborative approach was necessary for the industry to harness this technology successfully. "IME's consortium with Qualcomm Technologies and STATS ChipPAC focuses on pushing forward cost-effective manufacturing approaches in a timely manner."

For Qualcomm Technologies, this collaboration "helps support its ability to optimise the technology and achieve cost and performance needs, said Jim Lederer, the company's executive vice president and general manager.

 

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