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Applied Materials and A*STAR IME to advance R&D in Fan-Out Wafer-Level Packaging

Kareyst Lin | Sept. 21, 2016
The FOWLP is expected to help make chips and end-user devices smaller, faster, and more power efficient.

The Institute of Microelectronics (IME) of the Agency for Science, Technology and Research (A*STAR) and materials engineering solutions company, Applied Materials, have announced a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore.

The organisations will expand the scope of their research and development (R&D) collaboration to focus on advancing Fan-Out Wafer-Level Packaging (FOWLP), the two companies said in a joint press release on 20 September 2016.

The FOWLP is a key technology inflection expected to help make chips and end-user devices smaller, faster, and more power efficient.

In addition to the existing facility at Singapore's Science Park II, the Centre will expand to a second location at Fusionopolis 2.

 "With the entire R&D value stream from ideation to product development being carried out locally via this joint lab, the expansion will further Applied Materials' development of new technologies and products for global markets, while remaining a key contributor to Singapore's innovation economy," said Russell Tham, Regional President, Applied Materials Southeast Asia.

The Internet of Things (IoT) and Big Data are driving forces in today's market of interconnected and multi-functional electronic devices.

FOWLP is considered a key technology platform for system scaling. It enables multiple chips to be integrated in a small form factor on a single package. This provides benefits for the mobile and wireless markets. Therefore, increased investment in the sector could help Singapore's standing as a global hub for semiconductor R&D.

 

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